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DI-SORIC索瑞克高性能光幕OLGSP 12/12
更新時(shí)間:2017-05-08   點(diǎn)擊次數(shù):593次

di-soric高性能光幕用于安全檢測(cè)晶片上的硅碎片,和檢測(cè)雙層晶片??梢栽谏a(chǎn)過程中盡早檢測(cè)出有缺陷的晶片材料,以降低次品率。本系列光幕可以通過適配器調(diào)節(jié)以檢測(cè)不同尺寸的晶片。由于本系列光幕的緊湊型設(shè)計(jì),它可以安裝在狹窄的空間。堅(jiān)固的金屬外殼和高防護(hù)等級(jí)都是它的特點(diǎn)。高性能光幕Reliable detection of double layers and fragments larger 10 mmElectronic potentiometer for adjusting wafer thickness and fragment sizeInput for switching between wafer sizes 125 mm and 156 mm

 



Metal casingHigh protection classOLGSP 12/12 M 50 D-K2.5-TS - 高性能光幕
OLGSP 12/12 M 50 D-K2.5-TS - 高性能光幕 - Drawing
OLGSP 12/12 M 50 D-K2.5-TS - 高性能光幕 - Connection diagramDetection of fragments larger 15 mm
Electronic potentiometer for adjusting wafer thickness and fragement size
Input for switching between wafer sizes 125 mm and 156 mm
Small size for mounting between two belts
Metal casing
High protection class

TECHNICAL INFORMATION (typ.)+20°C, 24V DC
Size55 x 166 x 8 mm (Dimensions)
Number of beams12
Emitted lightInfrared, clocked
Service voltage24 V DC + 10 % polarity-safe
Internal power consumption130 mA
Working distance≤ 50 mm Transmitter / Receiver (recommended)
Detection width156 / 125 mm switchable via pin selection "detection widths"
Penetrable wafer thickness≤ 300 μm (mono poly-crystalline silicium wafer material)
Transmitting power0…100 % digitally adjustable
Ambient temperature+5 … +40 °C
Ambient light immunity50 kLx
Protection classIP 67
Protection degreeIII, operation on protective low voltage
Casing materialAluminium black anodized
ConnectionKabel PU 2,5m with connector M8, 3-polig
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